MUMBAI, India, June 19 -- Intellectual Property India has published a patent application (202617058694 A) filed by Ttp Plc on May 08, 2026, for Microfluidic Chips And Methods Of Manufacture Thereof.
Inventors include Scott, Bruce; and Savov, Svilen.
The application for the patent was published on June 05, 2026, under issue no. 23/2026.
Abstract: There are provided methods of manufacturing microfluidic chips, the methods comprising forming one or more fluid channels in a first substrate layer, providing a second substrate layer in contact with the first substrate layer, and bonding the first substrate layer and second substrate layer together to form a wafer, and dividing the wafer to form the microfluidic chip, wherein dividing the wafer to form the microfluidic chip comprises irradiating the wafer with a laser, wherein the laser is focused inside the wafer to create one or more internal regions of laser modified material within the wafer wherein the one or more internal regions of laser modified material extend in an intended fracture plane defining a desired arrangement of the outlet surface of the microfluidic chip and applying mechanical stress to the wafer to fracture the wafer along the intended fracture plane.
Disclaimer: Curated by HT Syndication.
