Intellectual Property India Publishes Patent Application for Methods To Maintain And/Or Improve Adhesion After Anodizing Aluminum Or Titanium Substrates Bonded Together With Curable Compositions

MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647092374 A) filed by Henkel AG & Co. Kgaa on July 30, 2026, for Methods To Maintain And/Or Improve Adhesion After Anodizing Aluminum Or Titanium Substrates Bonded Together With Curable Compositions.

Inventors include Steinmetz, Christian D.; Nirmalchandar, Archith; Kinney, Jordan R.; and Hu, Fengshuo.

The application for the patent was published on August 07, 2026, under issue no. 32/2026.

Abstract: Provided herein is a method of preparing a bonded anodized metal assembly, comprising the steps of: A. Providing a first metal substrate with a bonding surface and an opposite surface; B. Disposing onto at least a portion of the bonding surface of the first metal substrate a primer composition, said primer composition comprising a metal ion selected from Group IV B transition metals of the Periodic Table of the Elements; C. Disposing a curable composition onto at least a portion of the primer- coated bonding surface of the first metal substrate, said curable composition comprising: An epoxy component and An anhydride component; D. Providing a second metal substrate with a bonding surface and an opposite surface; E. Optionally, providing and disposing onto at least a portion of the bonding surface of the second metal substrate the primer composition; F. Optionally, providing a curable composition onto at least a portion of the primer-coated bonding surface of the second metal substrate; G. Mating the curable composition-coated, primer-coated bonding surface of the first metal substrate and the second metal substrate, a bonding surface of which has optionally been primer coated and/or optionally curable composition coated, to form an assembly and exposing the assembly to conditions favorable and for a time sufficient to cure the curable composition to form a bonded metal assembly; H. Exposing the bonded metal assembly to anodizing conditions for a time sufficient to form a bonded anodized metal assembly.

Disclaimer: Curated by HT Syndication.