MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202647094822 A) filed by Qualcomm Incorporated on August 05, 2026, for Methods For Multi-Memory Configuration Support Within Die Architectures And Packaging.
Inventors include Mohan, Vivek; Andreev, Boris Dimitrov; Srinivas, Vaishnav; and Gupta, Piyush.
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: Methods and apparatuses for on-die logic that allow dies, such as a system-on-a-chips (SoCs), to support multiple memory devices in various die configurations. In one example, a die package comprises a first memory device and a system-on-a-chip (SoC). The SoC includes a first plurality of physical layer interfaces electrically connected to the first memory device, wherein the SoC and the first memory device are in a first die package configuration. The SoC also includes a second plurality of physical layer interfaces configured to electrically connect to a second memory device, wherein the SoC and the second memory device are in a second die package configuration In some instances, the first die package configuration is package-on-package (PoP), and the second die configuration is system-in-a-package (SiP).
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