MUMBAI, India, Oct. 26 -- Intellectual Property India has published a patent application (202617089636 A) filed by Armstrong World Industries, Inc. on July 23, 2026, for Methods For Encapsulating Phase Change Materials.
Inventors include Fitzhugh, Gilbert, W.; Frantz, William, H.; Krick, Charles, G.; Chang, Ying; Cavanaugh, Jason, T.; Conrad, Travis, A.; Hibbs, Marlee, E.; Lengle, Benjamin; and Horwath, Peter.
The application for the patent was published on October 23, 2026, under issue no. 43/2026.
Abstract: A method for forming an encapsulated shape stabilized phase change composite material includes mixing a phase change material with a liquid carrier in a heated environment to yield a liquid phase change material composition, mixing the liquid phase change material composition with a composite carrier to yield a shape stabilized phase change composite material, cooling the shape stabilized phase change composite material to yield shape stabilized phase change composite material granules, coating the phase change composite material granules with a sealant, and coating the phase change composite material granules with a barrier filler. The resulting encapsulated phase change materials could be further compressed into composite sheet and fabricated for building product applications.
Disclaimer: Curated by HT Syndication.
