MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202647076939 A) filed by Henkel AG & Co. Kgaa on June 22, 2026, for Method Of Separating Bonded Articles.
Inventors include Franken, Uwe; Lammerschop, Olaf; Roepert, Marie-Christin; and Lu, Yuzhou.
The application for the patent was published on July 03, 2026, under issue no. 27/2026.
Abstract: The present disclosure is directed to a method for debonding a bonded article, said method comprising the steps of: method for debonding a bonded article, said method comprising the steps of: a) providing a bonded article comprising at least one layer of a first adhesive interposed between two substrate surfaces, said bonded article being further provided with at least one layer of a second adhesive which is interposed between said two substrate surfaces, wherein: a fibrous web is at least partially incorporated into the or each layer of first adhesive; and, the or each layer of first adhesive has a dry film thickness of from 10 to 500 µm; b) treating the bonded article at a temperature of from 20 to 90°C with a solution in a polar solvent of at least one compound selected from the group consisting of: C10 to C26 fatty acids; salts of C10 to C26 fatty acids; and, C1-C4 alkyl esters of C10 to C26 fatty acids, wherein said solution has a pH of from 3 to 14; and, c) separating said at least one layer of first adhesive from its interposition between said two substrate surfaces.
Disclaimer: Curated by HT Syndication.
