MUMBAI, India, July 30 -- Intellectual Property India has published a patent application (202411068023 A) filed by Indian Institute Of Technology Delhi on September 09, 2024, for Method Of Fabricating Two-Dimensional Metallic Meshes For Electromagnetic Interference (emi) Shielding.
Inventors include Ray, Nirat; and Chakraborty, Arijit.
The application for the patent was published on July 24, 2026, under issue no. 30/2026.
Abstract: The present subject matter relates to a method of fabricating a two-dimensional metallic mesh for electromagnetic interference shielding. The method (100) comprises the steps of synthesizing (102) a Polyvinyl Alcohol (PVA) coating on a substrate to form a PVA coated substrate; depositing (104) a metallic film on the PVA coated substrate; and separating (106) the deposited metallic film from the PVA coated substrate by submerging the PVA coated substrate with metallic coating in deionized (DI) water to form two-dimensional metallic mesh. The method provides for a simple, cost-effective and innovative approach for developing ultrathin and optically transparent metallic mesh for shielding against electromagnetic interference.
Disclaimer: Curated by HT Syndication.
