MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202527126985 A) filed by Dexerials Corporation on December 15, 2025, for Method For Producing Adhesive Film And Adhesive Film, And Method For Producing Structural Body And Structural Body.
Inventors include Matsubara, Makoto; Kamiya, Kazunobu; and Akutsu, Yasushi.
The application for the patent was published on October 02, 2026, under issue no. 40/2026.
Abstract: Provided are: a method for producing an adhesive film having excellent storage stability, and an adhesive film; and a method for producing a structural body, and a structural body. The present invention involves: a molding step for molding a film layer of a curing agent-free adhesive composition that contains no curing agent; and an arrangement step for transferring a latent curing agent to the film layer from a transfer substrate on which the latent curing agent is disposed, and exposing the latent curing agent from at least one surface of the film layer or bringing the latent curing agent near the at least one surface of the film layer to dispose the latent curing agent. By disposing the latent curing agent after molding the film layer, progress of curing reaction can be suppressed, and excellent storage stability can be obtained. By disposing the latent curing agent on the surface of the film layer, reaction by the curing agent is started, and excellent adhesive strength can be obtained.
Disclaimer: Curated by HT Syndication.
