MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647092604 A) filed by Resonac Corporation on July 30, 2026, for Method For Manufacturing Substrate With Conductive Via, Substrate With Conductive Via, Method For Manufacturing Circuit Board With Conductive Via, And Circuit Board With Conductive Via.
Inventors include Ejiri Yoshinori; Sakamoto Masumi; Shimizu Chiaki; Oikawa Futoshi; Uragami Hiroshi; Kai Seiji; Morijiri Tomoki; Kikuchi Naoyuki; Urashima Kosuke; Kurahashi Shunsuke; Nishimoto Masayoshi; Yokozumi Tomomi; and Akai Kunihiko.
The application for the patent was published on August 07, 2026, under issue no. 32/2026.
Abstract: The objective of the present invention is to provide a method for manufacturing a substrate with a conductive via that can exhibit sufficiently low connection resistance even after interconnect formation, and whereby the resulting circuit board can have excellent connection reliability. The method for manufacturing a substrate with a conductive via comprises: a step S1 for preparing a substrate with a sintered metal body comprising a substrate with a hole opening in one or both main surfaces thereof and a sintered metal body having a porous structure provided inside the hole, the sintered metal body being exposed at the opening of the hole; and a step S2 for providing a resin-containing portion including a photosensitive resin composition or a curing thereof on the sintered metal body of the substrate with a sintered metal body. The method for manufacturing a substrate with a conductive via is also useful as a technology for reducing the environmental impact of plating.
Disclaimer: Curated by HT Syndication.
