MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202631109710 A) filed by National Institute Of Technology, Jamshedpur on September 12, 2026, for Method For Low-Heat-Input Joining Of Dissimilar Metallic Workpieces With Controlled Intermetallic Compound Growth.
Inventors include Neeraj Kumar; Dr. Mayuri Baruah; and Dr. Ashok Kumar Jha.
The application for the patent was published on September 18, 2026, under issue no. 38/2026.
Abstract: The present invention relates to a method for low-heat-input joining of dissimilar metallic workpieces to form a defect-free, metallurgically bonded joint with controlled intermetallic compound growth. Abutting edges of an AA6061-T6 aluminum alloy workpiece and a commercially pure copper workpiece are prepared, aligned across a 0.5 mm to 1.0 mm interface gap, and clamped. Under a continuous flow of high-purity argon shielding gas, a cyclic electric arc is struck using an ER4043 aluminum- silicon filler wire. A continuous weld bead is deposited via a synchronized short-circuit metal transfer cycle operating at 50 Hz to 130 Hz. The cycle coordinates forward wire feeding at 3.5 m/min to 5.5 m/min under 70 A to 90 A current, short-circuit detection via voltage drop, current reduction, and mechanical wire retraction. Translating the torch at 5 mm/s to 7 mm/s maintains net heat input between 80 J/mm and 180 J/mm, restricting brittle aluminum-copper intermetallic layer growth.
Disclaimer: Curated by HT Syndication.
