MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202611069665 A) filed by Indian Institute Of Technology Delhi on June 03, 2026, for Method For Joining A Pair Of Dissimilar Metallic Materials Susceptible To Surface Oxide Formation.
Inventors include Sangeeta Santra; Abhishek Das; Vijay Sharma; and Nitin Srivastava.
The application for the patent was published on August 07, 2026, under issue no. 32/2026.
Abstract: The present invention discloses a method (100) for joining a pair of dissimilar metallic materials susceptible to surface oxide formation. The method includes positioning a first metallic material and a second metallic material in an overlapping configuration to define an interface between opposing contact surfaces. A first ultrasonic welding cycle is applied at the interface under predetermined parameters to induce compressive deformation and fragment oxide layers present on the surfaces of the metallic materials. A second ultrasonic welding cycle is subsequently applied under the predetermined parameters to suppress elastic spring-back and achieve interfacial conformation between the contact surfaces, thereby producing a substantially pore-free and crack-free bonded interface. The metallic materials include oxide-prone dissimilar metals such as aluminium-copper and titanium-niobium. The welding cycles are performed under ambient atmospheric conditions without vacuum systems or active external heating. Post-weld heat treatment promotes interdiffusion and enhances joint longevity.
Disclaimer: Curated by HT Syndication.
