MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202641078481 A) filed by Mlr Institute Of Technology on June 25, 2026, for Method For Fabricating Cu/Sic Surface Composites Using Friction Stir Processing.
Inventor includes Dr. Harikishor Kumar.
The application for the patent was published on July 03, 2026, under issue no. 27/2026.
Abstract: This invention relates to a solid-state method for fabricating a Cu/SiC surface composite via Friction Stir Processing (FSP) tailored for high-performance heat sink applications. The process involves embedding SiC particles (2–8 µm) into a copper substrate by filling a pre-machined groove and utilizing a rotating tool to induce severe plastic deformation. By maintaining a rotational speed of 1150 RPM and a traverse speed of 35 mm/min, the invention achieves significant grain refinement, reducing the copper matrix grain size from 34 µm to 2.7 µm. The resulting composite demonstrates a 57% increase in surface hardness and a 27% increase in ultimate tensile strength compared to pure copper. The solid-state nature of the fabrication prevents the formation of brittle intermetallic phases and porosity, ensuring a high-quality interfacial bond between the matrix and reinforcement. This composite provides superior wear resistance and microstructural stability, making it highly suitable for thermal management in advanced electronic packaging systems.
Disclaimer: Curated by HT Syndication.
