MUMBAI, India, June 24 -- Intellectual Property India has published a patent application (202647070777 A) filed by Schleuniger AG on June 06, 2026, for Method And Device For Machining, Perforating, Cutting Into, Or Cutting Through A Specific Layer Of A Multi-Layer Cable.
Inventors include Deschler, Raphael; and Hofer, Reto International Bureau.
The application for the patent was published on June 12, 2026, under issue no. 24/2026.
Abstract: The invention relates to a method and a device for precisely machining specific layers (1) of a cable (2). In the process, the cable contour or the contour of the specific layer (1) is first measured in order to then precisely cut into the layer, perforate the layer, or the like along the contour using tools (4).
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