MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202641111188 A) filed by National Institute Of Technology, Tiruchirappalli on September 16, 2026, for Metamaterial Absorber With Thermoplastic Polyurethane Substrate.
Inventors include R. , Ranjith Kumar; and Ramanujam, Parthasarathy.
The application for the patent was published on September 25, 2026, under issue no. 39/2026.
Abstract: A metamaterial absorber (100) and a method of manufacturing the same are disclosed. The metamaterial absorber includes a unit-cell structure having a dielectric substrate (104) of thermoplastic polyurethane (TPU) and a conductive patterned layer (102) disposed on a first side of the dielectric substrate (104). The conductive patterned layer (102) includes a square-loop resonator (112), a four-petal resonator structure (116) disposed within the square-loop resonator (112), and a centrally disposed circular resonator structure positioned within the four-petal resonator structure (116). A plurality of resistive elements (110) electrically coupled across a plurality of slots (114) formed through corresponding sides of the square-loop resonator (112). An air gap (106) positioned on a second side of the dielectric substrate (104). A conductive ground plane (108) spaced from the dielectric substrate (104) by the air gap (106) and arranged to cooperate with the conductive patterned layer (102) to suppress transmission through the unit-cell structure.
Disclaimer: Curated by HT Syndication.
