MUMBAI, India, June 26 -- Intellectual Property India has published a patent application (202617068625 A) filed by Cuptronic Technology Ltd. on June 01, 2026, for Metalization Of Surfaces.
Inventors include Gthe, Sven; Atthoff, Bjrn; and Lindelf, Magnus.
The application for the patent was published on June 19, 2026, under issue no. 25/2026.
Abstract: There is disclosed a method for application of a metal on a substrate, comprising the steps of a) providing the substrate which comprises abstractable hydrogen atoms and/or C=C bonds, b) producing a covalently bound negatively charged polymer on the substrate, by a reaction between the surface groups and monomers, wherein chain propagation of a growing polymer chain is carried out to the desired extent, wherein step b) is carried out in an environment with no more than 2 wt% water present, c) contacting the substrate with metal ions, d) reducing the metal ions to metal, and e) depositing further metal on the metal. An advantage is both improved adhesion and that a range of different ions such as copper ions can be used in the process.
Disclaimer: Curated by HT Syndication.
