MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202644033458 A) filed by Idemia France on March 19, 2026, for Metal Smart Card And Method For Manufacturing A Smart Card Of This Kind.
Inventors include Duval, Agns; Gac, Philippe; and Groult, Tiphaine.
The application for the patent was published on September 25, 2026, under issue no. 39/2026.
Abstract: The invention relates to a card body (2) comprising a metal layer (4) exhibiting a first recess (10) formed from a first side (5) and a second recess (11) formed from a second side (6) and opening into the first recess (10), an electronic module (15) received in the first recess and comprising a microcircuit (23) and a first set of bonding pads (24) electrically connected to the microcircuit, an electrical connection block (19) received in the second recess (11) and comprising a second set of bonding pads (29) electrically contact-connected with the first set of bonding pads, and a radio-frequency antenna (17) disposed outside the first recess and electrically connected to the second set of bonding pads (29), the first set of bonding pads and the second set of bonding pads electrically interconnecting the microcircuit and the radio- frequency antenna.
Disclaimer: Curated by HT Syndication.
