MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202621062859 A) filed by Rukshana Yezdi Dhabhar on May 18, 2026, for Mechatronic Headset Assembly With Actuated Mechanical Flaps For Selective Acoustic Transparency.
Inventor includes Kayomarz Yezdi Dhabhar Minor.
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: The present disclosure relates to a mechatronic headset assembly configured to provide selective acoustic transparency. The assembly comprises a pair of ear cup housings interconnected by a headband, each ear cup housing including movable mechanical flaps actuated by micro-servo motors through a mechanical linkage system. The mechanical flaps are movable between a closed position providing acoustic isolation and an open position establishing a direct physical pathway for transmission of external environmental sound into the ear cup housing. The assembly further comprises an environmental sensing subsystem including at least one acoustic sensor and at least one ultrasonic sensor operatively connected to a control module configured to selectively actuate the mechanical flaps based on detected environmental conditions. The arrangement enables controlled physical transmission of external sound while maintaining audio playback functionality within the headset assembly.
Disclaimer: Curated by HT Syndication.
