MUMBAI, India, June 24 -- Intellectual Property India has published a patent application (202617061402 A) filed by Nissei Asb Machine Co. , Ltd. on May 14, 2026, for Manufacturing Device And Manufacturing Method For Temperature Adjustment Mold And Resin Container.
Inventors include Komiyama Tomokazu; and Nagasaki Atsushi.
The application for the patent was published on June 12, 2026, under issue no. 24/2026.
Abstract: This temperature adjustment mold for adjusting the temperature of a preform that has a bottomed cylindrical shape and that is to be applied to blow molding of a container made of a resin comprises: a cavity mold that accommodates, on the inner side thereof, the preform and that contacts the outer surface of the preform; and a cooling mold that is inserted into the preform and that introduces compressed air into the preform to perform cooling. The cavity mold accommodates, in a replaceable manner, a heat-insulating member that has an annular shape and that includes a heat insulation region having a thermal conductivity lower than that of the cavity mold. The heat-insulating member is disposed at an outer periphery of a target section of the preform corresponding to a grounding portion of the container and abuts the target section to adjust the temperature of the target section to be higher than those of other sections.
Disclaimer: Curated by HT Syndication.
