MUMBAI, India, June 22 -- Intellectual Property India has published a patent application (202641050151 A) filed by K. Ramakrishnan College Of Engineering on April 20, 2026, for Magnetically Actuated Liquid Metal Interconnect System For Reconfigurable Motherboard Architecture.
Inventors include Rani C; Joshini K P; Kalpana T; Rithika V; and Subasri M.
The application for the patent was published on June 12, 2026, under issue no. 24/2026.
Abstract: An electronic interconnect system is disclosed that enables the 5 non-destructive, reconfigurable assembly of hardware components without the use of permanent solder. The invention utilizes a microfluidic architecture embedded within a substrate, containing a conductive liquid metal alloy (such as Galinstan) doped with ferromagnetic micro-particles. Electrical connectivity is established through the application of a magnetic 10 pulse from an electro-permanent magnet (EPM), which displaces the liquid metal through micro-channels to form a bridge with a secondary component terminal. The use of EPM technology ensures a bi-stable connection, allowing the liquid metal to remain in a "connected" or "disconnected" state without the continuous consumption of electrical power .By integrating a control circuit, such as an H-bridge driver with capacitive discharge, the system allows for the rapid, heat-free replacement or upgrade of central processing -N E units, sensors, and memory modules. This invention provides a sustainable solution to the global electronic waste crisis by facilitating component-level repairability and modularity in consumer and industrial electronics. E units, sensors, and memory modules. This invention provides a sustainable solution to the global electronic waste crisis by facilitating component-level repairability and modularity in consumer and industrial electronics.
Disclaimer: Curated by HT Syndication.
