MUMBAI, India, June 26 -- Intellectual Property India has published a patent application (202617067416 A) filed by Xiamen Hongfa Electric Power Controls Co. , Ltd. on May 29, 2026, for Magnetic Latching Relay.
Inventors include Dai, Wenguang; Zhong, Shuming; Li, Fangneng; and Hu, Jianxin.
The application for the patent was published on June 19, 2026, under issue no. 25/2026.
Abstract: Provided in the present application is a magnetic latching relay, including a bottom plate, a housing, a first lead-out pin, a second lead-out pin, a coil lead-out pin, a magnetic circuit system and a contact system, wherein the contact system uses a double-contact anti-short-circuit structure; the housing and the bottom plate enclose the magnetic circuit system and the contact system in an internal space; and the first lead-out pin, the second lead-out pin and the coil lead-out pin penetrate the bottom surface of a base so as to be led out downwards, so that subsequent mounting and wiring of an electromagnetic relay can be facilitated, thereby also facilitating mounting and use by a customer. Moreover, the housing is mounted and fitted with the base, so that a closed space can be formed, thereby better protecting internal devices, and improving the adaptability of the electromagnetic relay to severe external environments. In addition, after the housing is mounted and fitted with the base, an adhesive can be dispensed on the bottom surface of the base to perform sealing, thereby further improving the leakproofness of the electromagnetic relay and the adaptability to external environments.
Disclaimer: Curated by HT Syndication.
