MUMBAI, India, June 24 -- Intellectual Property India has published a patent application (202617062258 A) filed by Cemecon AG on May 16, 2026, for Machining Tool For Machining Multilayer Printed Circuit Boards.
Inventor includes Strasmann, Martin.
The application for the patent was published on June 12, 2026, under issue no. 24/2026.
Abstract: The invention relates to a machining tool (1), said machining tool (1) having a substantially cylindrical main part (2), wherein the main part (2) comprises a shaft (3) and a cutting part (4) which allows the tool (1) to be precisely positioned directly on the workpiece as a starting point for a machining process. According to the invention, this is achieved in that at least the cutting part (4) is at least partly coated with an electrically conductive diamond coating (5).
Disclaimer: Curated by HT Syndication.
