MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202647081884 A) filed by Hanwha Semitech Co. , Ltd. on July 02, 2026, for Machining System For Tracking Production Of Workpiece And Tracking Machining Method Thereof.
Inventors include So, Chang Ju; and Heo, Seung Bin.
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: The present invention relates to a machining system for tracking the production of a workpiece. The machining system comprises: a production management device that assigns a unique key for tracking the production history of a workpiece and sets the value of illuminance for generating an identification mark corresponding to the unique key on the surface of the workpiece; and a machining device that forms the identification mark on the surface of the workpiece by means of data of the production management device and machines the workpiece. The production management device: ensures the illuminance that can be formed on the surface of the workpiece in order to form the identification mark of the workpiece before mass producing the workpiece; generates and detects the unique key according to the machining device and the workpiece; and enables the mass production of the workpiece by matching an initial unique key and the detected unique key.
Disclaimer: Curated by HT Syndication.
