MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202617049212 A) filed by Shenzhen Shokz Co. , Ltd. on April 17, 2026, for Loudspeaker Assembly And Earphone.
Inventors include Zhu, Guangyuan; Zhang, Lei; and Qi, Xin.
The application for the patent was published on June 26, 2026, under issue no. 26/2026.
Abstract: Disclosed in the present application are a loudspeaker assembly and an earphone. The loudspeaker assembly comprises a housing assembly, an air conduction loudspeaker, and a bone conduction loudspeaker, wherein the housing assembly is provided with an accommodating space; the air conduction loudspeaker is arranged in the accommodating space; and the bone conduction loudspeaker is arranged in the accommodating space. The housing assembly is further provided with a sound output hole and a pressure relief hole which are in communication with the accommodating space, wherein each of the sound output hole and the pressure relief hole is used for conducting some of the sound waves generated by the air conduction loudspeaker to the external environment; and the pressure relief hole and the sound output hole are respectively located on two opposite side surfaces of the housing assembly. By means of the described configuration, the present application can reduce the mutual impact between the sound waves conducted by the sound hole and those conducted by the pressure relief hole, so that low-frequency sound quality can be improved, thereby improving sound quality.
Disclaimer: Curated by HT Syndication.
