MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202641112308 A) filed by Pragati Engineering College on September 18, 2026, for Lightweight Lattice-Structured Cutting Tool With Enhanced Heat Dissipation.
Inventors include Dr. Avinash Gudimetla; Mrs. Aravinda Karri; Mrs. V. Venkata Lakshmi Dadala; and Mr. N Raghuveer.
The application for the patent was published on September 25, 2026, under issue no. 39/2026.
Abstract: The present invention relates to a lightweight lattice-structured cutting tool having enhanced heat dissipation for use in machining operations such as milling, turning, and drilling. The tool body is fabricated with an internal lattice core comprising a network of interconnected unit cells that reduce overall weight while maintaining structural rigidity and load-bearing capacity. The lattice core defines multiple internal heat conduction pathways together with an integrated coolant channel network that circulates cooling fluid through the tool body to rapidly extract heat generated at the cutting zone. External heat dissipation fins formed integrally with the tool body increase surface area for convective heat transfer, while an embedded temperature sensing module monitors real-time temperature near the cutting edge. The reduced mass of the lattice-structured body lowers rotational inertia, enabling higher spindle speeds and reduced vibration during machining. A wear-resistant coating applied to the cutting insert and tool body further improves durability under high-temperature cutting conditions. The tool body, including the lattice core and coolant channels, is fabricated using an additive manufacturing process as a single monolithic structure. By combining reduced weight with efficient, distributed heat dissipation, the invention minimises thermal expansion, reduces tool wear, and maintains dimensional accuracy during high-speed and prolonged machining operations. Overall, the invention improves machining performance, extends tool life, and enhances productivity in metal cutting applications.
Disclaimer: Curated by HT Syndication.
