MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202647100780 A) filed by Boe Technology Group Co. , Ltd.; and Hefei Boe Ruisheng Technology Co. , Ltd. on August 20, 2026, for Light Emitting Substrate And Method Of Fabricating Light Emittnig Substrate.
Inventors include Dong, Wenbo; Tian, Jian; and Hu, Jian.
The application for the patent was published on September 18, 2026, under issue no. 38/2026.
Abstract: A light emitting substrate is provided. The light emitting substrate includes a base substrate; one or more pads on the base substrate; one or more insulating layers on a side of the one or more pads away from the base substrate, wherein, in a region having the one or more pads, the one or more insulating layers are absent, forming one or more vias through the one or more insulating layers; one or more solders on a side of the one or more pads away from the base substrate; and a light emitting element bonded to the one or more pads through at least the one or more solders at least partially in the one or more vias. A respective pad of the one or more pads includes a first main body and a respective first portion connected to the first main body.
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