MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202418001197 A) filed by Seoul Semiconductor Co. , Ltd. on January 06, 2024, for Light Emitting Diode Package.
Inventors include Kim, Myung Jin; and Oh, Kwang Yong.
The application for the patent was published on June 26, 2026, under issue no. 26/2026.
Abstract: A light emitting diode package comprising: a light emitting diode chip emitting light; and a light transmissive member covering an upper surface of the light emitting diode chip and comprising a light transmissive resin and a plurality of reinforcing fillers, wherein one or more reinforcing fillers of the plurality of reinforcing fillers have at least two side surfaces having different lengths and the plurality of reinforcing fillers are dispersed in and throughout the light transmissive resin, wherein the plurality of reinforcing fillers comprises one selected from a group of Si, Al, Fe, Ba, Ca, Mg, and Na, and wherein the plurality of reinforcing fillers comprises one selected from a group of glass fibers formed of SiO2,Al2O3, MgO, CaO, Na2O, K2O and B2O3.
Disclaimer: Curated by HT Syndication.
