MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202418050243 A) filed by Seoul Viosys Co. , Ltd. on July 01, 2024, for Light-Emitting Device Package And Application Thereof.
Inventors include Jang, Jong Min; and Kim, Chang Yeon.
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: A light emitting device comprising: a printed circuit board having a front surface and a rear surface; at least one light source disposed on the front surface and configured to emit light in a direction away from the printed circuit board; and a light transmittable material disposed on the printed circuit board and covering the light source, wherein the light source includes: a light emitter disposed on the printed circuit board; an insulation material disposed on the light emitter; and bump electrodes configured to electrically connect the light emitter and the printed circuit board, wherein the light transmittable material has a groove region formed on a surface of the light transmittable material, wherein the bump electrodes are spaced apart from one another, and wherein the light transmittable material has a first thickness and is configured to transmit at least 50% of light emitted from the light source, the light transmittable material including a filler to change a direction of the light emitted from the light source.
Disclaimer: Curated by HT Syndication.
