MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202617078125 A) filed by Uacj Corporation on June 24, 2026, for Lid Material And Packaging Material.
Inventors include Kato Hisaya; Koishikawa Atsushi; Maeda Tomohiro; and Haga Yohei.
The application for the patent was published on September 18, 2026, under issue no. 38/2026.
Abstract: A lid material 30 for sealing a storage part 21 of a storage container 20 includes: a base material layer 35; a circuit pattern 32 provided on the base material layer 35 and having a wiring route that is broken when the storage part is opened; a resin layer 37 covering the circuit pattern 32 from the side opposite to the base material layer; and a layer 31 for heat adhesion with the storage container 20. The wiring route is provided with a terminal part connected to an external device 40 for detecting breakage. The resin layer 37 is divided into a first area 37A1 covering the terminal part and a second area 37A2 covering the part other than the terminal part. The thickness T2 of the second area 37A2 of the resin layer 37 is larger than the thickness T1 of the first area.
Disclaimer: Curated by HT Syndication.
