MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202647101906 A) filed by H&f Corporation on August 24, 2026, for Laser Irradiation Device, Laser Processing Apparatus Including Same, And Laser Processing Method.
Inventors include Tampa Yusuke; Khare Vivek Kumar; Hosokawa Takumi; Okazaki Akira; Fujii Shoichiro; Yoshida Masashi; and Suzuki Atsushi.
The application for the patent was published on September 18, 2026, under issue no. 38/2026.
Abstract: [Problem] To provide: a laser irradiation device capable of inhibiting scattering of spatter while cutting even a plated metal sheet; a laser processing apparatus including the same; and a laser processing method. [Solution] The present invention relates to: a laser irradiation device 10 for cutting, with laser light, a plated metal sheet obtained by forming a plating film on a surface of a metal sheet; a laser processing apparatus 100 including said laser irradiation device; and a laser processing method. The laser irradiation device 10 comprises a laser head 2 having a built-in lens for collecting the laser light, and a laser oscillator 3 for introducing the laser light into the laser head 2, and irradiates the plated metal sheet with round small-diameter laser light 21a, 21b and large-diameter laser light 22a, 22b having diameters larger than those of the small-diameter laser light 21a, 21b, as the laser light. Said irradiation with the large-diameter laser light 22a, 22b breaks the plating film, and said irradiation with the small-diameter laser light 21a, 21b cuts the metal sheet.
Disclaimer: Curated by HT Syndication.
