MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202647113351 A) filed by Nhk Spring Co. , Ltd. on September 22, 2026, for Laminated Spring.
Inventors include Hayashida, Hiroki; and Yamauchi, Yuichiro.
The application for the patent was published on September 25, 2026, under issue no. 39/2026.
Abstract: This laminated spring is formed by laminating a plurality of spring members, and includes: a first spring member serving as a base; one or a plurality of second spring members laminated on the first spring member; and a fastening member for fastening the first and second spring members. A hole through which the fastening member is inserted is formed in the first and second spring members. The second spring members have formed therein: a first surface modification part that is a portion of a surface on a side subjected to compressive stress during operation and that is obtained by performing surface modification on a region including a portion of an opening edge of the hole; and a second surface modification part that is provided on a portion of an inner peripheral surface forming the hole and that is continuous with the first surface modification part. When an extension length from the opening edge of the hole of the second surface modification part is D1, and a plate thickness of the second spring member is T1, 0.3 × T1 = D1 is satisfied.
Disclaimer: Curated by HT Syndication.
