MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202647076923 A) filed by Resonac Corporation on June 22, 2026, for Laminated Film And Method For Producing Laminated Film.
Inventors include Koshino Miharu; Iwanaga Yukihiro; Ohkubo Keisuke; Kimura Naohiro; and Harada Tomonori.
The application for the patent was published on July 03, 2026, under issue no. 27/2026.
Abstract: This laminated film comprises: a long protective film; a plurality of adhesive layers provided on the protective film; a pressure- sensitive adhesive film provided on the plurality of adhesive layers; and a defective product identification mark provided at a position, on the pressure-sensitive adhesive film, corresponding to a defective adhesive layer that is an adhesive layer which is defective among the plurality of adhesive layers. This method for producing a laminated film comprises: a preparation step for preparing a raw film comprising a long protective film, a plurality of adhesive layers provided on the protective film, and a pressure-sensitive adhesive film provided on the plurality of adhesive layers; an inspection step for inspecting the plurality of adhesive layers of the raw film; and a marking step for imparting a defective product identification mark to a position, on the pressure-sensitive adhesive film, corresponding to the defective adhesive layer that is an adhesive layer determined to be defective in the inspection step.
Disclaimer: Curated by HT Syndication.
