MUMBAI, India, June 26 -- Intellectual Property India has published a patent application (202647070958 A) filed by Toppan Holdings Inc. on June 08, 2026, for Laminate For Packaging, And Packaging Bag.
Inventor includes Ishii Rika.
The application for the patent was published on June 19, 2026, under issue no. 25/2026.
Abstract: This laminate for packaging comprises, in the order given: a base material layer; a gas barrier layer comprising an inorganic oxide layer; and a sealant layer. The base material layer is a biaxially stretched polypropylene-based resin film. The sealant layer is a polypropylene-based resin film. The laminate contains 90 mass% or more of a polypropylene-based resin with reference to the total amount thereof, and has a thermal shrinkage rate in an MD direction of less than 5% and a thermal shrinkage rate in a TD direction of less than 10% after heated in an oven at 150°C for 15 minutes, as determined by formulas (1) and (2). (1) MD-direction thermal shrinkage rate (%) = (MD-direction length before heating - MD-direction length after heating)/MD-direction length before heating × 100 (2) TD-direction thermal shrinkage rate (%) = (TD-direction length before heating - TD-direction length after heating)/TD-direction length before heating × 100
Disclaimer: Curated by HT Syndication.
