MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202617074660 A) filed by Ticona LLC on June 16, 2026, for Laminate For A Printed Circuit Board.
Inventors include Zhang, Xiaowei; and Culligan, Sean.
The application for the patent was published on September 18, 2026, under issue no. 38/2026.
Abstract: A laminate comprising a fibrous substrate and a conductive layer positioned adjacent to the fibrous substrate is provided. The fibrous substrate is formed from fibers that include a polymer composition. The polymer composition contains a liquid crystalline polymer, and it has a melting temperature of from about 300°C to about 400°C and a dissipation factor of about 0.005 or less at a frequency of 10 GHz.
Disclaimer: Curated by HT Syndication.
