MUMBAI, India, July 24 -- Intellectual Property India has published a patent application (202527106265 A) filed by Jx Advanced Metals Corporation on November 03, 2025, for Laminate, Heat Dissipation Member, Method For Manufacturing Same, Heat Dissipation Housing, And Method For Manufacturing Same.

Inventor includes Ori,yuki.

The application for the patent was published on July 17, 2026, under issue no. 29/2026.

Abstract: Provided is a laminate exhibiting good heat dissipation properties while achieving weight reduction. The laminate has at least one metal layer and at least one resin layer. The unit weight of the laminate is 2.0 kg/m2 or less, and the thermal diffusivity in a direction perpendicular to the lamination direction of the laminate is 10 × 10-6m2/s or more.

Disclaimer: Curated by HT Syndication.