MUMBAI, India, June 22 -- Intellectual Property India has published a patent application (202641050578 A) filed by Hindustan College Of Engineering And Technology on April 21, 2026, for Internship/Industrial Training With Placement Opportunity.
Inventors include Ms. Sathya S; Dr. S. Shankar; Dr. N. J. R. Muniraj; Faizai Roshan D; Kadheeskaa D; Kaviya A; Lithika S I; Balakrishnan P; Dinesh V; Harishkumar; and Runjith T Malo.
The application for the patent was published on June 12, 2026, under issue no. 24/2026.
Abstract: Abstract: This invention presents a scalable, cloud-integrated, and intelligent mobile-based Internship and Industry-Institute Interaction Portal designed as a full-stack cross-platform application for modern educational institutions. The system operates in real-time, leveraging a structured technology framework that combines mobile application development, cloud computing, and role-based access control to deliver efficient placement and internship management capabilities. The system utilizes a multi-module architecture comprising: Student Application Module + Mentor Review System + Industry Recruitment Management + Administrator Dashboard + Real- Time Data Synchronization. It is implemented using a modern mobile architecture with a TypeScript-based React Native frontend, Firebase cloud backend, and integrated real-time database for efficient data handling and placement analytics. The complete development-to-deployment pipeline includes: • • • • Data collection and management of student profiles, job postings, and application records . Role-based access control for students, mentors, industry partners, and administrators . Integration of authentication, job management, and real-time notification modules . Deployment of a cloud-synced mobile application for Android and iOS platforms . The proposed system achieves improved placement management efficiency, enhanced communication between stakeholders, and accurate real-time application tracking. Experimental results demonstrate significant improvement over traditional manual placement systems, with better accessibility and centralized process management. The final outcomes include: • • • • Real-time placement and internship management system Improved communication between students, mentors, and industry partners Early detection of application bottlenecks for timely administrative action Integrated system with multiple role-based functional modules The invention is applicable to engineering colleges, universities, online placement cells, and large-scale academic institutions requiring centralized and data-driven recruitment solutions
Disclaimer: Curated by HT Syndication.
