MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647093040 A) filed by Qualcomm Incorporated on July 31, 2026, for Interconnect Including Conductor In Photo-Imageable Dielectric Layer.
Inventor includes Shin, Heun Gun.
The application for the patent was published on August 07, 2026, under issue no. 32/2026.
Abstract: A device includes a substrate that includes a photo-imageable dielectric (PID) layer having a layer surface and multiple sidewalls extending from an opening in the layer surface to define a trench. The substrate also includes a conductive interconnect configured to form at least a portion of a conductive path of the substrate. The conductive interconnect includes an embedded conductor within the trench. The conductive interconnect also includes a metal trace on the layer surface and electrically connected to the embedded conductor.
Disclaimer: Curated by HT Syndication.
