MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088349 A) filed by Qualcomm Incorporated on July 20, 2026, for Integrated Device Comprising Metallization Portion With Step Pad Interconnects.
Inventors include Sun, Yangyang; Zhang, Xuefeng; and Chen, Jun.
The application for the patent was published on July 24, 2026, under issue no. 30/2026.
Abstract: An integrated device comprising a die substrate; a die interconnection coupled to the die substrate; an encapsulation layer coupled to a side surface of the die substrate and a side surface of the die interconnection; a plurality of pad interconnects coupled to the die interconnection; a passivation layer coupled to the die interconnection; and a plurality of metallization interconnects, wherein one or more metallization interconnects from the plurality of metallization interconnects is coupled to one or more pad interconnects from the plurality of pad interconnects, wherein the plurality of metallization interconnects comprise a first step pad interconnect structure.
Disclaimer: Curated by HT Syndication.
