MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202641096228 A) filed by Gudlyf Mobility Pvt Ltd on August 10, 2026, for Integrated Cryostructural Orchestration Platform For Pressurized Cryogenic Systems.
Inventors include Ajeet Babu Kumar Parasumanna; and Kumar Seshaier Parasumanna.
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: An integrated cryostructural orchestration platform (10) for pressurized cryogenic systems comprises a double-walled cryogenic pressure vessel configured for storage and transport of liquefied hydrogen or liquefied oxygen at pressures up to substantially 100 bar. The platform includes an inner liner (12) as the sole pressure-retaining member and an outer layer (14) defining an insulating gap (15). At each pole, a unitary end boss (16) joins the inner liner (12), bridges the insulating gap (15), passes through the outer layer (14), and projects outward with an axial port (17). The outer layer (14) is selectively coupled to the end boss (16) through studs or rods (22), a radial flange (26), a girth weld (28), or a threaded collar (30) with a flexible bellows (32). The integrated structural configuration transfers loads while preserving thermal isolation without filament winding, thereby reducing heat leak and boil-off. Structural and thermal analyses performed for the present invention demonstrate improved mechanical integrity and thermal performance.
Disclaimer: Curated by HT Syndication.
