MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202647100686 A) filed by Advanced Micro Devices, Inc. on August 20, 2026, for Integrated Circuit Die Stack With A Dual-Sided Bridge Die.
Inventors include Alam, Arsalan; Mandalapu, Chandra Sekhar; Wang, Liwei; Dubey, Manish; Gupte, Omkar Deepak; Boyapati, Sri Ranga Sai; and Vadlamani, Sai.
The application for the patent was published on September 18, 2026, under issue no. 38/2026.
Abstract: Disclosed herein are a dual-sided bridge die, an integrated circuit die package assembly having the dual-sided bridge die, and a method for fabricating the integrated circuit die package assembly. A dual-sided bridge die includes a substrate; a first redistribution layer built on a top surface of the substrate and configured to couple with a bottom surface of a first integrated circuit die; and a second redistribution layer built on a bottom surface of the substrate and configured to couple with a top surface of a second integrated circuit die. The top surface and the bottom surface of the substrate are respectively disposed on opposite sides of the substrate.
Disclaimer: Curated by HT Syndication.
