MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647093831 A) filed by Qualcomm Incorporated on August 03, 2026, for Integrated Circuit (ic) Package Including Two Substrates And Vertical Interconnects Coupling The Two Substrates, The Vertical Interconnects Comprising A Metal Ball And Metal Pin Combination To Address An Increased Distance Between Substrates.
Inventors include Wang, Zhijie; Buot, Joan Rey Villarba; and Patil, Aniket.
The application for the patent was published on August 07, 2026, under issue no. 32/2026.
Abstract: Aspects disclosed include an integrated circuit (IC) package including two substrates and vertical interconnects coupling the two substrates, the vertical interconnects comprising a metal ball and metal pin combination to address an increased distance between substrates. The vertical interconnects are disposed in a mold layer between the two substrates. The mold layer also includes a die, a plurality of metal pins, and a plurality of metal balls coupled to the plurality of metal pins to form the vertical interconnects. Larger distances between the two substrates are desirable when a die's thickness is increased to increase thermal dissipation from the die. As an example, by utilizing a plurality of metal ball and pin combinations as vertical interconnects, larger distances between the two substrates may be advantageously achieved with reduced risk of electrical shorting between vertical interconnects and without compromising pitch between vertical interconnects.
Disclaimer: Curated by HT Syndication.
