MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202644035369 A) filed by Te Connectivity Solutions Gmbh on March 24, 2026, for Insulating Housing For Providing Heat Insulation And Installation Kit.
Inventors include Heindl, Christian; Kehl, Ladislaus; Lagden, Russell; Ludwiczak-Aron, Magdalena.; and Oliveira, Patricia.
The application for the patent was published on September 25, 2026, under issue no. 39/2026.
Abstract: Insulating housing (100) for providing a heat insulation around a cable (190). The insulating housing (100) comprises a main body (110) having a plurality of longitudinal grooves (111) along a longitudinal axis (102) of the main body (110) and further comprises two peripheral regions (120). The main body (110) is arranged between the peripheral regions (120), and the insulating housing (100) is foldable along the plurality of longitudinal grooves (111) to form an enclosure. Each peripheral region (120) is configured to contact the cable (190). Further, an installation kit (140) for installing a heat shrink sleeve (170) is provided. The installation kit (140) comprises the insulating housing (100), a heat shrink sleeve (170), a heating unit (174), and a control unit (176) arranged at a base plate (178). FIGURE 20
Disclaimer: Curated by HT Syndication.
