MUMBAI, India, Sept. 14 -- Intellectual Property India has published a patent application (202648105254 A) filed by Halo Industries, Inc. on September 01, 2026, for Incident Radiation Induced Subsurface Damage For Controlled Crack Propagation In Material Cleavage.
Inventors include Iancu, Andrei, Teodor; and Rudy, Charles, William.
The application for the patent was published on September 11, 2026, under issue no. 37/2026.
Abstract: A cleaving system employs a shaper, a positioner, an internal preparation system, an external preparation system, a cleaver, and a cropper to cleave a workpiece into cleaved pieces. The shaper shapes a workpiece into a defined geometric shape. The positioner then positions the workpiece such that the internal preparation system can generate a separation layer at the cleaving plane. The internal preparation system focuses a laser beam internal to the workpiece at a focal point and scans the focal point across the cleaving plane to create the separation layer. The external preparation system scores the external surface of the workpiece at a location coincident with the separation layer. The cleaver cleaves the workpiece by propagating the crack on the external surface along the separation layer. The cropper shapes the cleaved piece into a geometric shape as needed. [FIGURE 1]
Disclaimer: Curated by HT Syndication.
