MUMBAI, India, June 26 -- Intellectual Property India has published a patent application (202621052728 A) filed by Sage University on April 24, 2026, for Implant Assembly And Method Of Preparing And Deploying Implant Assembly.
Inventors include Dr. Prashant Jain; Ms. Sakshi Agrawal; Dr. Payal Jaiswal; Dr. Dipul Kumar Biswas; Anand Mahajan; Astitva Sharma; Subodh Gaur; and Vedant Dubey.
The application for the patent was published on June 19, 2026, under issue no. 25/2026.
Abstract: ABSTRACT The present disclosure relates to biodegradable orthopedic fixation. The implant assembly (100) includes a biodegradable orthopedic implant (102) formed from a biodegradable polymer combined with hydroxyapatite particles derived from calcined animal bone waste and a dispersed phenolic antioxidant. A moisture- barrier package (104) encloses the implant (102), maintaining internal relative humidity below a predetermined threshold during ambient temperature storage in tropical climate conditions. A humidity indicator (106) disposed within the moisture-barrier package (104) provides visual indication of internal relative humidity through irreversible color change at multiple predetermined humidity thresholds. The phenolic antioxidant and moisture-barrier package (104) cooperatively retard oxidative and hydrolytic degradation of the biodegradable polymer during tropical ambient storage, rendering the biodegradable orthopedic implant (102) compatible with steam autoclave sterilization at a point of care. The implant assembly (100) enables reliable storage and terminal sterilization of biodegradable orthopedic implants in resource-limited, high-humidity environments. FIG. 1
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