MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202647115266 A) filed by Danfoss Power Solutions Inc.; and Illinois Tool Works Inc. on September 25, 2026, for Hydraulic Circuit Arrangement With Reduced Vibration And Noise.
Inventors include Lagarde, Jrmie; Hansen, Andrew; Williamson, Christopher; Edmondson, Jeremy; Pascale, Jordan; Hennen, James; and Rindahl, Paul.
The application for the patent was published on October 02, 2026, under issue no. 40/2026.
Abstract: A hydraulic circuit arrangement includes a plurality of electronically-commutated pumps providing flow to a common hydraulic line. Each pump is connected to the common hydraulic line via a hydraulic line. The plurality of electronically-commutated pumps includes at least one quantized electronically-commutated pump and at least one unquantized electronically-commutated pump. A controller includes a pressure control and a flow distribution algorithms. The flow distribution algorithm is configured to allocate the target flow value among the at least one quantized electronically-commutated pump and at least one unquantized electronically-commutated pump based on proximity of the pumps to the common hydraulic line and the length of the hydraulic output line of each pump to reduce noise and vibration in the arrangement.
Disclaimer: Curated by HT Syndication.
