MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202641077521 A) filed by Manipal Academy Of Higher Education on June 23, 2026, for Hybrid Thermal Management System And Method For Cooling Electronic Devices.
Inventors include Anoop Kanjirakat; Swaroop Jain; and Pramod Balwantrao Salunkhe.
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: Embodiments of the present disclosure relate to a hybrid thermal management system (100) and method (200) for cooling one or more heat-generating electronic devices. The system (100) may include a heat sink (102), heat pipes (104), a heat rejection assembly and airflow generating device (110). The heat sink (102) is configured to receive thermal energy and phase change material (PCM) reservoir (120) thermally integrated with the heat sink (102). The PCM (120) is configured to absorb thermal energy through sensible and latent heat storage. The heat pipe (104) includes an evaporator section (106a) configured to receive thermal energy and a condenser section (106b) configured to reject thermal energy. The airflow generating device (110) is configured to direct a cooling medium across the condenser section (106b) and/or the heat sink (102). Thermal energy generated by the electronic device is transferred to the heat sink (102) and absorbed by the PCM (120).
Disclaimer: Curated by HT Syndication.
