MUMBAI, India, June 24 -- Intellectual Property India has published a patent application (202617061564 A) filed by Spreadtrum Communications Shanghai Co. , Ltd. on May 14, 2026, for Hybrid Package-On-Package Structure.
Inventors include Liu, Mengqi; Qiu, Yuanhong; Tian, Fuyou; Yao, Li; and Chen, Si.
The application for the patent was published on June 12, 2026, under issue no. 24/2026.
Abstract: Provided in the present disclosure is a hybrid package-on-package structure. The package-on-package structure comprises: a memory, which has signal cells used for transmitting signals; and an adapter board, which has a first surface and a second surface arranged opposite each other, wherein the first surface faces the memory; the second surface faces an SOC substrate; first-type solder balls arranged in a first direction and second-type solder balls arranged in a second direction are provided on the second surface; the first-type solder balls are connected to the signal cells of the memory and are configured for the signal fan-out of the memory; the second-type solder balls are configured to support the adapter board and the SOC substrate, the second-type solder balls are divided into a plurality of solder ball groups, and the spacing between adjacent solder ball groups in the second direction is greater than the spacing between adjacent second solder balls in the solder ball groups; and the first direction is different from the second direction; and the SOC substrate is in signal connection with the first-type solder balls. By means of the solution, the adapter board and the SOC substrate can be supported; moreover, the mold flow filling yield can be improved and the package layout design of the SOC substrate is facilitated.
Disclaimer: Curated by HT Syndication.
