Intellectual Property India Publishes Patent Application for Hvac Installation And System With Reduced Thermal Bridging, As Well As Method And Use Of Raised Portions For Providing Reduced Thermal Bridging

MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202617098432 A) filed by Flktgroup Sweden Ab on August 14, 2026, for Hvac Installation And System With Reduced Thermal Bridging, As Well As Method And Use Of Raised Portions For Providing Reduced Thermal Bridging.

Inventors include Johansson, Hardy; and Brandt, Rickard.

The application for the patent was published on October 30, 2026, under issue no. 44/2026.

Abstract: A Heating, Ventilation, and Air Conditioning, HVAC, installation (11) configured to provide a reduced heat transfer between a first sheet (1) and a second sheet (2) of the HVAC installation (11) wherein the first sheet (1) comprises one or more raised portions (3) that abuts the second sheet (2) when mounted, wherein the one or more than one raised portion (3) separates the first sheet (1) from the second sheet ( 2 ), thereby providing a gas gap between the first sheet (1) and the second sheet (2) thereby minimizing the contact surface between the first and the second sheets.

Disclaimer: Curated by HT Syndication.