MUMBAI, India, June 24 -- Intellectual Property India has published a patent application (202647069027 A) filed by Astemo, Ltd. on June 02, 2026, for Housing Assembly And Method For Manufacturing Housing Assembly.
Inventors include Chiba Kentaro; Murata Daisuke; and Nohara Misato.
The application for the patent was published on June 12, 2026, under issue no. 24/2026.
Abstract: Provided are: a housing assembly with which it is possible to ensure adhesion and sealing performance of a housing and to prevent falling of screws; and a manufacturing method for said housing assembly. In a housing assembly (U), screws (50) are used to fix a housing (200) to one surface (101) of a base body (100). The housing (200) is provided with a housing body (202) that constitutes an accommodation part (200a). The housing (200) is fixed using an adhesive (G) that has a sealing function and is interposed at abutment portions between the housing body (202) and the base body (100). Said one surface (101) of the base body (100) has formed therein screw holes (116) into which the screws (50) are threaded. The screws (50) and the screw holes (116) are configured to have the adhesive (G) interposed therebetween.
Disclaimer: Curated by HT Syndication.
