MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202614006569 A) filed by Vertiv Corporation on January 22, 2026, for Hinged Panelboard Assembly.
Inventors include Carl Caldwell; and Michael Strain.
The application for the patent was published on August 07, 2026, under issue no. 32/2026.
Abstract: Hinged Panelboard Assembly A power distribution panel can include a cabinet, one or more breakers at least partially disposed within the cabinet, and one or more busbars at least partially disposed within the cabinet. The busbars can include one or more line busbars, one or more neutral busbars, and one or more ground busbars. Any or all of the breakers and/or any or all of the busbars can be rotated among an installation position, in which they can be clear of a cable pulling area within the cabinet, and an operations position, in which they can be at least partially disposed in the cable pulling area.
Disclaimer: Curated by HT Syndication.
