MUMBAI, India, Sept. 14 -- Intellectual Property India has published a patent application (202617060723 A) filed by Soluforce B. V. on May 13, 2026, for High Pressure Electrofusion Fitting.
Inventors include Cloos, Peter Jeroen; Laan, Robbert Petrus Johannes; and Stammes, Erik.
The application for the patent was published on September 11, 2026, under issue no. 37/2026.
Abstract: An electrofusion fitting for connecting to at least one pipe section fitted in an insertion end thereof, the fitting comprising an inner bush made of thermoplastic material and comprising one or more resistance wires, wherein the resistance wires can be connected to an electric power source for melting a surface of the inner bush facing an external surface of the at least one pipe section to create a welded joint; and an outer bush; wherein the inner bush and outer bush in axial dimension have mechanical locking parts with at least one gap between the inner bush and the outer bush, which mesh with each other to transmit axial and/or tangential forces.
Disclaimer: Curated by HT Syndication.
