MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202641075762 A) filed by Indian Institute Of Technology Madras Iit Madras on June 18, 2026, for High-Efficiency And High-Density Buck Converter For Power Delivery.
Inventors include Manivannan, Anbarasu; Mamidanna, Sri Ramachandra Rao; Kasthuri, Rajaganesh; Chilakalapudi, Ganesh; and Kuselan, Rajamohana.
The application for the patent was published on June 26, 2026, under issue no. 26/2026.
Abstract: Disclosed is a high-efficiency, high-power-density DC-DC buck converter. The DC-DC buck converter includes two power stages that work in tandem to evenly distribute load current among the two power stages and comprising a pair of Gallium Nitride (GaN) transistors where each pair of GaN transistors includes a high-side GaN transistor and a low-side GaN transistor. Further, high-side GaN transistors are placed at a first end of a multilayer printed circuit board (PCB) and low-side GaN transistors are placed at a second end of the multilayer PCB opposite to the first end for uniform temperature distribution. Further, the DC-DC buck converter includes one or more thermal vias and a controller circuit, where the one or more thermal vias are positioned directly under GaN transistors of the two power stages in the multilayer PCB to transfer heat efficiently and the controller circuit controls timings of the GaN transistors. Representative Figure: FIG. 3
Disclaimer: Curated by HT Syndication.
